JPS5875850A - Ｉｃパツケ−ジのシ−ル用カバ−及びその成形方法 - Google Patents

Ｉｃパツケ−ジのシ−ル用カバ−及びその成形方法

Info

Publication number
JPS5875850A
JPS5875850A JP17474481A JP17474481A JPS5875850A JP S5875850 A JPS5875850 A JP S5875850A JP 17474481 A JP17474481 A JP 17474481A JP 17474481 A JP17474481 A JP 17474481A JP S5875850 A JPS5875850 A JP S5875850A
Authority
JP
Japan
Prior art keywords
cover
package
solder
cover body
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17474481A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0221140B2 (en]
Inventor
Shozo Hayashi
林　正蔵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP17474481A priority Critical patent/JPS5875850A/ja
Publication of JPS5875850A publication Critical patent/JPS5875850A/ja
Publication of JPH0221140B2 publication Critical patent/JPH0221140B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
JP17474481A 1981-10-31 1981-10-31 Ｉｃパツケ−ジのシ−ル用カバ−及びその成形方法 Granted JPS5875850A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17474481A JPS5875850A (ja) 1981-10-31 1981-10-31 Ｉｃパツケ−ジのシ−ル用カバ−及びその成形方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17474481A JPS5875850A (ja) 1981-10-31 1981-10-31 Ｉｃパツケ−ジのシ−ル用カバ−及びその成形方法

Publications (2)

Publication Number Publication Date
JPS5875850A true JPS5875850A (ja) 1983-05-07
JPH0221140B2 JPH0221140B2 (en]) 1990-05-11

Family

ID=15983916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17474481A Granted JPS5875850A (ja) 1981-10-31 1981-10-31 Ｉｃパツケ−ジのシ−ル用カバ−及びその成形方法

Country Status (1)

Country Link
JP (1) JPS5875850A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02235361A (ja) * 1989-03-09 1990-09-18 Sumitomo Metal Mining Co Ltd ハーメチックシールカバー及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4855763U (en]) * 1972-10-26 1973-07-17
JPS5432312A (en) * 1977-08-16 1979-03-09 Toshiba Corp Magnetic data write apparatus
JPS5546558A (en) * 1978-09-29 1980-04-01 Fujitsu Ltd Metallic cover plate for semiconductor package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4855763U (en]) * 1972-10-26 1973-07-17
JPS5432312A (en) * 1977-08-16 1979-03-09 Toshiba Corp Magnetic data write apparatus
JPS5546558A (en) * 1978-09-29 1980-04-01 Fujitsu Ltd Metallic cover plate for semiconductor package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02235361A (ja) * 1989-03-09 1990-09-18 Sumitomo Metal Mining Co Ltd ハーメチックシールカバー及びその製造方法

Also Published As

Publication number Publication date
JPH0221140B2 (en]) 1990-05-11

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